TGA4513(2004) Ver la hoja de datos (PDF) - TriQuint Semiconductor
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Fabricante
TGA4513 Datasheet PDF : 10 Pages
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Advance Product Information
Dec 14, 2004
TGA4513
Chip Assembly Diagram(1)
VG
VD
RF In
See note (2)
RF Out
VG
VD
Note
(1): Minimum 1 uF bypass Capacitors are required on both drain and gate power supplies.
(2): Alternate configuration without these bondwires: the maximum positive supply current is reduced to 1.3A.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com Info: info-mmw@tqs.com
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