M24512-W M24512-R M24512-DF
Package information
Table 22. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale
package mechanical data (continued)
ddd
-
-
0.060
-
-
0.0024
eee
-
-
0.060
-
-
0.0024
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Figure 20. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale
package recommended footprint
1. Dimensions are expressed in millimeters.
EXPSV[‘
&IB)3B9
DS6520 Rev 30
39/47
46