M24512-DFCS6(2018) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

M24512-DFCS6
(Rev.:2018)

512-Kbit serial I²C bus EEPROM

STMicroelectronics 

Package information

M24512-W M24512-R M24512-DF

9.4

WLCSP8 package information

Figure 19. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale

package outline

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1. Drawing is not to scale.

Table 22. WLCSP - 8 bumps, 1.271 x 1.937 mm, 0.5 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

A

0.500

0.540

0.580

0.0197

0.0213

0.0228

A1

-

0.190

-

-

0.0075

-

A2

-

0.350

-

b(2)

-

0.270

-

-

0.0138

-

-

0.0106

-

D

-

1.271

1.291

-

0.0500

0.0508

E

-

1.937

1.957

-

0.0763

0.0770

e

-

1.000

-

-

0.0394

-

e1

-

0.866

-

-

0.0341

-

e2

-

0.500

-

-

0.0197

-

e3

-

0.433

-

-

0.0170

-

F

-

0.202

-

-

0.0080

-

G

-

0.469

-

-

0.0185

-

aaa

-

-

0.110

-

-

0.0043

bbb

-

-

0.110

-

-

0.0043

ccc

-

-

0.110

-

-

0.0043

38/47

DS6520 Rev 30

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