STPS8L30 Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Fabricante
STPS8L30 Datasheet PDF : 7 Pages
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Packaging information
STPS8L30
Figure 9. Forward voltage drop versus
forward current
Figure 10.
Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm) (DPAK)
IFM(A)
100.0
Tj=150°C
(typical values)
10.0
1.0
Tj=125°C
(maximum values)
Tj=25°C
(maximum values)
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Rth(j-a)(°C/W)
100
80
60
40
20
S(mm²)
0
0
2
4
6
8
10 12 14 16 18 20
2
Packaging information
Table 4.
H
L4
DPAK dimensions
E
B2
L2
A
C2
B
G
R
A1
R
C
A2
0.60 MIN.
V2
DIMENSIONS
REF. Millimeters
Inches
A
A1
A2
B
D B2
C
C2
D
E
G
H
L2
L4
V2
Min. Max
2.20 2.40
0.90 1.10
0.03 0.23
0.64 0.90
5.20 5.40
0.45 0.60
0.48 0.60
6.00 6.20
6.40 6.60
4.40 4.60
9.35 10.10
0.80 typ.
0.60 1.00
0°
8°
Min. Max.
0.086 0.094
0.035 0.043
0.001 0.009
0.025 0.035
0.204 0.212
0.017 0.023
0.018 0.023
0.236 0.244
0.251 0.259
0.173 0.181
0.368 0.397
0.031 typ.
0.023 0.039
0°
8°
4/7
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