SST25VF016B
6.0 PACKAGING DIAGRAMS
8-Lead Small Outline Integrated Circuit (S2AE/F) - .208 Inch Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
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All linear dimensions are in millimeters (max/min).
Coplanarity: 0.1 mm
Maximum allowable mold flash is 0.15 mm at the package ends and 0.25 mm between leads.
DS20005044C-page 24
Downloaded from: http://www.datasheetcatalog.com/
Microchip Technology Drawing C04-14005A Sheet 1 of 1
2015 Microchip Technology Inc.