TDA2170
TYPICAL PERFORMANCES
Parameter
Vs – Supply Voltage
Is – Current
tfly – Flyback Time
* Ptot – Power Dissipation
* Rth c–a – Heatsink
Tamb
Tj max
to
Vi
V7
* Worst case condition.
110° TVC
5.9 Ω / 10 mH
24
280
0.6
4.2
7
60
110
20
2.5
50
MOUNTING INSTRUCTIONS
The power dissipated in the circuit must be re-
moved by adding an external heatsink.
Thanks to the MULTIWATT® package attaching
the heatsink is very simple, a screw or a compres-
Figure 2 : Application Circuit
110° TVC
9.6 Ω / 27 mH
22.5
175
1
2.5
13
60
110
20
2.5
47
90° TVC
15 Ω / 30 mH
25
125
0.7
2.05
16
60
110
20
2.5
52
Unit
V
mA
ms
W
°C/W
°C
°C
ms
VPP
VP
sion spring (clip) being sufficient. Between the
heatsink and the package it is better to insert a layer
of silicon grease, to optimize the thermal contact ;
no electrical isolation is needed between the two
surfaces.
Figure 5 : Maximum Allowable Power Dissipation versus Ambient Temperature
6/7