EMIF03-SIM05F3 Ver la hoja de datos (PDF) - STMicroelectronics

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Fabricante

EMIF03-SIM05F3

EMI filter with SWP protection for SIM interface

STMicroelectronics 

EMIF03-SIM05F3

3

Package information

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 19. WLCSP package dimensions

∅ 255 ± 40 µm

3 21

A

B

C

1.22 mm ± 0.05 µm

Figure 20. Footprint recommendations Figure 21. Marking

Copper pad Diameter:

220 µm recommended

260 µm maximum

Solder mask opening:

300 µm minimum

Solder stencil opening:

220 µm recommended

Dot, ST logo

ECOPACK® grade

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

xxz

y ww

Doc ID 023284 Rev 1

7/9

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