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TN1625(2007) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
TN1625
(Rev.:2007)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TN1625 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package information
3
Package information
TN1625, TYN616, TYN816
Epoxy meets UL94,V0
Cooling method: C
Recommended torque value: 0.4 - 0.6 N·m
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 5.
I4
l3
l2
TO-220AB dimensions
Dimensions
Ref.
Millimeters
Inches
B
ØI
L
A
a1
a2
b1
e
Min. Typ. Max. Min. Typ. Max.
C
b2
F
c2
M
c1
A 15.20
15.90 0.598
0.625
a1
3.75
0.147
a2 13.00
14.00 0.511
0.551
B 10.00
10.40 0.393
0.409
b1 0.61
0.88 0.024
0.034
b2 1.23
1.32 0.048
0.051
C 4.40
4.60 0.173
0.181
c1 0.49
0.70 0.019
0.027
c2 2.40
2.72 0.094
0.107
e 2.40
2.70 0.094
0.106
F 6.20
6.60 0.244
0.259
ØI 3.75
3.85 0.147
0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65
2.95 0.104
0.116
l2 1.14
1.70 0.044
0.066
l3 1.14
1.70 0.044
0.066
M
2.60
0.102
6/9

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