HFBR-5107T Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HFBR-5107T

100VG-AnyLAN Multimode Fiber Transceivers in Low Cost 1x9 Package Style

HP => Agilent Technologies 

, The HP 1300 nm transmitters are

allowed to generate the worst

,

case Active Output jitter shown in

NO INTERNAL CONNECTION

NO INTERNAL CONNECTION

Table 27 of section 18.9 when

driven by circuits optimized for

these link applications. The

Active Output Specifications of

the 100VG-AnyLAN standard are

met by the HFBR-5106.

The HP 1300 nm receivers

tolerate the worst case input

optical response time and

HFBR-510X

TOP VIEW

Rx

Rx Tx

Tx

VEE RD

RD

SD VCC VCC TD

TD VEE

1

2

3

4

5

6

7

8

9

C1

C2

systematic jitter shown in

Table 27 of Section 18.9. The

Active Input Specification of the

IEEE 802.12 100VG-AnyLAN

standard are met by the

HBFR-5106.

The jitter specifications stated in

the 1300 nm transceiver

specification tables are derived

from the values in Table 27 of

section 18.9 of the IEEE 802.12

specification. They represent the

worst case jitter contributions

from the transceiver meeting the

VCC

L1 L2

R2 R3

TERMINATION


,,
,

,
 AT PHY

DEVICE

INPUTS

VCC

R5

R7

C6

R6

R8

C3

C4

VCC FILTER

AT VCC PINS

TRANSCEIVER

R9

R10

R1

R4

C5

TERMINATION

AT TRANSCEIVER

INPUTS

RD RD SD

VCC

TD

TD

NOTES:

THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT

OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT

BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.

R1 = R4 = R6 = R8 = R10 = 130 OHMS.

R2 = R3 = R5 = R7 = R9 = 82 OHMS.

C1 = C2 = C3 = C5 = C6 = 0.1 µF.

C4 = 10 µF.

L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.

overall system jitter in Annex E.

In practice the typical jitter

Figure 7. Recommended Decoupling and Termination Circuits.

contribution of the HP transceiv-

ers is well below these maximum

allowed values.

Recommended Handling

Precautions

It is advised that normal static

precautions be taken in the

ground without proper current

limiting impedance.

Solder and Wash Process

Compatibility

Shipping Container

The transceiver is packaged in a

shipping container designed to

protect it from mechanical and

ESD damage during shipment or

handling and assembly of these

The transceivers are delivered

storage.

transceivers to prevent damage

with a protective process plug

which may be induced by

inserted into the duplex SC

Board Layout –

electrostatic discharge (ESD).

connector receptacle. This

Decoupling Circuit and

The HFBR-510X series of

process plug protects the optical Ground Planes

transceivers are certified as

Mil-Std-883C Method 3015.4

Class 1 products.

Care should be used to avoid

shorting the receiver data or

signal detect outputs directly to

subassemblies during wave solder

and aqueous wash processing and

acts as a dust cover during

shipping. These transceivers are

compatible with either industry

standard wave or hand soldering

processes.

It is important to take care in the

layout of your circuit board to

achieve optimum performance

from these transceivers. Figure 7

provides a good example of a

schematic for a power supply

decoupling circuit that works

155

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