HI-8588-10 Ver la hoja de datos (PDF) - Holt Integrated Circuits
Número de pieza
componentes Descripción
Fabricante
HI-8588-10 Datasheet PDF : 7 Pages
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HI-8588-10 PACKAGE DIMENSIONS
8-PIN PLASTIC DIP
.385 ±.015
(9.799 ±.381)
.250 ± .010
(6.350 ±.254)
.100 BSC
(2.54)
.135 ±.015
(3.429 ±.381)
.1375 ±.0125
(3.493 ±.318)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.019 ±.002
(.483 ±.102)
.025 ±.010
(.635 ± .254)
.055 ±.010
(1.397 ±.254)
inches (millimeters)
Package Type: 8P
.300 ±.010
(7.620 ±.254)
.0115 ±.0035
(.292 ±.089)
.335 ±.035
(8.509 ±.889)
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
millimeters (inches)
Package Type: 8HN
4.90 BSC
(0.193)
6.00
(0.236)
BSC
PIN 1
3.90
(0.154)
BSC
0.41 ± 0.10
(0.016 ± 0.004)
0.175 ± 0.075
(0.007 ± 0.003)
See Detail A
1.25
(0.049)
min.
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
(01..02570)BSC
0° to 8°
0.835 ± 0.435
(0.033 ± 0.017)
0.175 ± 0.075
(0.007 ± 0.003)
Detail A
HOLT INTEGRATED CIRCUITS
6
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