SFT821N-BS Ver la hoja de datos (PDF) - SEOUL SEMICONDUCTOR

Número de pieza

componentes Descripción

Fabricante

SFT821N-BS

Top View LED

SEOUL SEMICONDUCTOR 

7. Soldering Profile

(1) Reflow Soldering Conditions / Profile (Lead Free Solder)

Temp

[°C]

260

240

220

200

180

150

Pre-heating

Rising

5 °C/sec

Tm : Reflow machine setting temp (max 30 sec.)

Ts : Surface temp of PCB (max)

Ts : Surface temp of PCB (recommend)

Ts : Surface temp of PCB (min)

Cooling

-5 °C/sec

0

Time

[Hr]

(2) Hand Soldering conditions

Do not exceed 4 seconds at maximum 315ºC under soldering iron.

(3) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter, the picking up nozzle that does not affect the silicone

resign should be used.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

SSC-QP-7-03-08(REV.00)

SEOUL SEMICONDUCTOR CO., LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea

Phone : 82-2-2106-7305~6

- 7/14 -

SSC-SFT821N-S

Share Link: