MAS1175 Ver la hoja de datos (PDF) - Micro Analog Systems Oy
Número de pieza
componentes Descripción
Fabricante
MAS1175 Datasheet PDF : 8 Pages
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SOLDERING INFORMATION
Resistance to Soldering Heat
Maximum Reflow Temperature
Maximum Number of Reflow Cycles
Seating Plane Co-planarity
Lead Finish
DA1175.005
26 March, 2002
According to RSH test IEC 68-2-58/20 2*220°C
235°C
2
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P1
DO
P2
PO
E
WF
T
BO
A
AO
D1
User Direction of Feed
KO
Section A-A
Pin 1 Designator
Dimension
Ao
Bo
Do
D1
E
F
Ko
Po
P1
P2
T
W
Min/Max
5.00 ±0.10
3.20 ±0.10
1.50 +0.1/-0.0
1.50 min
1.75
5.50 ±0.05
1.45 ±0.10
4.0
8.0 ±0.10
2.0 ±0.05
0.3 ±0.05
12.00 +0.30/-0.10
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
6 (8)
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