TDA8140 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

TDA8140

HORIZONTAL DEFLECTION POWER DRIVER

STMicroelectronics 

TDA8140

The power dissipation on this application condition

is about 1.3W and Figures 10 and 11 show two

ways of heatsinking.

In the first case, a PCB copper area is used as a

heatsink L= 65mm while in the second case, the

device is soldered to an external heatsink ; in both

examples, the thermal resistance junction ambient

is 35°C/W.

Figure 10 : Example of Heatsink using

P.C. Board Copper (L = 65mm)

Copper Area 35µ Thickness

The presence of thermal shut-down circuit does

mean that the heatsink can have a smaller factor

of safety compared with that of a conventional

circuit.

If for any reason, the junction temperature in-

creases up to 150°C, the thermal shut-down simply

switches off the device.

Figure 11 : Example of an External Heatsink

L

9/10

Share Link: