MXSMCGLCE80A Ver la hoja de datos (PDF) - Microsemi Corporation

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MXSMCGLCE80A

1500 Watt Low Capacitance Surface Mount Transient Voltage Suppressor

Microsemi Corporation 

MSMCGLCE6.5A – MXLSMCGLCE170Ae3,

MSMCJLCE6.5A – MXLSMCJLCE170Ae3

MAXIMUM RATINGS @ 25 ºC unless otherwise stated

Parameters/Test Conditions

Junction and Storage Temperature

Thermal Resistance Junction-to-Lead (1)

Peak Pulse Power dissipation @ 25 ºC (at 10/1000 µs,

see figures 1, 2, and 3) (2)

Clamping Factor

@ Full Rated Power

@ 50 % Rated Power

tclamping (0 volts to V (BR) min.)

Rated Average Power Dissipation

Solder Temperature @ 10 s

TL = +50 ºC

Symbol

TJ and TSTG

R ӨJL

P PP

CF

t clamping

P M(AV)

TSP

Value

-65 to +150

20

1500

1.4

1.30

< 5x10-9

5.0

260

Unit

ºC

ºC/W

W

s

W

oC

Notes: 1. Typical junction to lead (tab) at mounting plane.

2. With a repetition rate of 0.01% or less. When pulse testing, do not pulse in opposite direction (see “application schematics” section herein

and figures 5 & 6 for further protection in both directions.)

MECHANICAL and PACKAGING

• CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0.

• TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating. Solderable to MIL-STD-750, method 2026.

• MARKING: Part number with abbreviated prefix (MCLC6.5A, MCLC6.5Ae3, MCLC33, MCLC33e3, etc.).

• POLARITY: Cathode indicated by band.

• TAPE & REEL option: Standard per EIA-481-B with 16 mm tape (add “TR” suffix to part number). Consult factory for quantities.

• WEIGHT: Approximately 0.25 grams.

• See Package Dimensions on last page.

PART NOMENCLATURE

Reliability Level*

M

MA

MX

MXL

*(see High Reliability

Up-Screened Plastic

Products Portfolio)

Surface Mount

Package

1500 W Power Level

Lead Form

G = Gull-wing

J = J-bend

M SM C G LC E 6.5 A e3

RoHS Compliance

e3 = RoHS Compliant

Blank = non-RoHS Compliant

+/-5%Tolerance Level

Reverse Stand-Off Voltage

(see Electrical Characteristics

table)

Encapsulated Plastic Package

Low Capacitance

RF01002, Rev. C (1/4/13)

©2013 Microsemi Corporation

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