FDS4675_F085 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FDS4675_F085 Datasheet PDF : 5 Pages
| |||
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA
–40
V
∆BV DSS
∆TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
ID = –250 µA, Referenced to 25°C
VDS = –32 V, VGS = 0 V
–34
mV/°C
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V, VDS = 0 V
100 nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –20 V VDS = 0 V
–100 nA
On Characteristics (Note 2)
V GS(th)
∆V GS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = –250 µA
–1 –1.4 –3
V
ID = –250 µA, Referenced to 25°C
4.6
mV/°C
VGS = –10 V, ID = –11 A
VGS = –4.5 V, ID = –9.5 A
VGS=–10 V, ID =–11 A, TJ=125°C
10 13 mΩ
13 17
15 21
VGS = –10 V, VDS = –5 V
–25
A
VDS = –5 V,
ID = –11 A
44
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = –20 V, V GS = 0 V,
f = 1.0 MHz
4350
pF
622
pF
290
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = –20 V, ID = –1 A,
VGS = –4.5 V, RGEN = 6 Ω
VDS = –20 V, ID = –11 A,
VGS = –4.5 V
20 36
ns
29 46
ns
95 152 ns
60 96
ns
40 56
nC
11
nC
13
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = –2.1 A (Note 2)
–2.1 A
–0.7 –1.2 V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50°C/W when
mounted on a 1in2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS4675_F085 Rev. A
2
www.fairchildsemi.com
Share Link: 