ULLC0402FC12C-T710-2 Ver la hoja de datos (PDF) - ProTek Devices.

Número de pieza

componentes Descripción

Fabricante

ULLC0402FC12C-T710-2

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

ProTek Devices. 

DEVICE CHARACTERISTICS

ULLC0402FC3.3C*

thru

ULLC0402FC24C*

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

PARAMETER

Operating Temperature

Storage Temperature

SYMBOL

T

J

TSTG

VALUE

-55°C to 150°C

-55°C to 150°C

UNITS

°C

°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PART

NUMBER

(See Note 1)

RATED

STAND-OFF

VOLTAGE

MINIMUM

BREAKDOWN

VOLTAGE

MAXIMUM

LEAKAGE

CURRENT

TYPICAL

CAPACITANCE

ULLC0402FC3.3C

ULLC0402FC05C

ULLC0402FC08C

ULLC0402FC12C

ULLC0402FC15C

ULLC0402FC24C

Note 1: All devices are bidirectional.

VWM

VOLTS

3.3

5.0

8.0

12.0

15.0

24.0

@ 1mA

V(BR)

VOLTS

4.0

6.0

8.5

13.3

16.7

26.7

@VWM

I

D

µA

75

1.0

0.1

0.1

0.1

0.1

@0V, 1 MHz

C

pF

6

6

6

6

6

6

FIGURE 1

REFLOW SOLDER PROFILE

200°C

Instantaneous

to 200°C

225°C

5-10 sec

100°C

1-2 Minutes

to 150°C

1-2 Minutes to 25°C

Pre-Heat

Time

Soldering

Time

Cool Down

Time

Note: This reflow profile does not take into account the printed circuit board (PCB) material

heating time. Additional time may be required for the preheat time and cool down time upon the

PCB or board material.

05192.R0 8/03

*PATENT PENDING

2

www.protekdevices.com

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