APC3216SECK Ver la hoja de datos (PDF) - Kingbright
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APC3216SECK Datasheet PDF : 4 Pages
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APC3216SECK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1000
APPROVED: J. Lu
REV NO: V.1
CHECKED: Allen Liu
DATE:MAR/20/2003
DRAWN:D.L.HUANG
PAGE: 4 OF 4
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