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MSM6411A Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza
componentes Descripción
Fabricante
MSM6411A
OKI
Oki Electric Industry OKI
MSM6411A Datasheet PDF : 11 Pages
First Prev 11
¡ Semiconductor
PACKAGE DIMENSIONS
DIP16-P-300-2.54
MSM6411A
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.99 TYP.
11/11

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