TDA8552T Ver la hoja de datos (PDF) - NXP Semiconductors.

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TDA8552T

2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing

NXP Semiconductors. 

NXP Semiconductors

2 x 1.4 W BTL audio amplifiers with digital

volume control and headphone sensing

Product specification

TDA8552T; TDA8552TS

PINNING

SYMBOL

GND1

OUT2+

VDD1

HPS

MODE

UP/DOWN1

UP/DOWN2

VDD2

OUT2−

GND2

GND3

OUT1+

VDD3

GAINSEL

IN2

SVR

IN1

VDD4

OUT1−

GND4

PIN(1)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

DESCRIPTION

ground 1, substrate/leadframe

positive loudspeaker terminal

output channel 2

supply voltage 1

digital input for headphone

sensing

digital trinary input for mode

selection (standby, mute and

operating)

digital trinary input for volume

control channel 1

digital trinary input for volume

control channel 2

supply voltage 2

negative loudspeaker terminal

output channel 2

ground 2, substrate/leadframe

ground 3, substrate/leadframe

positive loudspeaker terminal

output channel 1

supply voltage 3

digital input for gain selection

audio input channel 2

half supply voltage, decoupling

ripple rejection

audio input channel 1

supply voltage 4

negative loudspeaker terminal

output channel 1

ground 4, substrate/leadframe

Note

1. For the SO20 (SOT163-1) package only: the ground

pins 1, 10, 11 and 20 are mechanically connected to

the leadframe and electrically to the substrate of the

die. On the PCB the ground pins can be connected to

a copper area to decrease the thermal resistance.

handbook, halfpage

GND1 1

20 GND4

OUT2+ 2

VDD1 3

HPS 4

19 OUT1−

18 VDD4

17 IN1

MODE 5

16 SVR

TDA8552T

UP/DOWN1 6

15 IN2

UP/DOWN2 7

14 GAINSEL

VDD2 8

OUT2− 9

13 VDD3

12 OUT1+

GND2 10

11 GND3

MGM610

Fig.2 Pin configuration.

2002 Jan 04

5

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