CS5201−1
The value for RqJA is calculated using Equation (3) and
the result can be substituted in Equation (1).
The value for RqJC is 3.5°C/W for a given package type
based on an average die size. For a high current regulator
such as the CS5201−1 the majority of the heat is generated
in the power transistor section. The value for RqSA depends
on the Heatsink type, while RqCS depends on factors such as
package type, Heatsink interface (is an insulator and thermal
grease used?), and the contact area between the Heatsink and
the package. Once these calculations are complete, the
maximum permissible value of RqJA can be calculated and
the proper Heatsink selected. For further discussion on
Heatsink selection, see application note “Thermal
Management,” document number AND8036/D, available
through the Literature Distribution Center or via our website
at http://onsemi.com.
ORDERING INFORMATION
Device
Type*
Package
Shipping†
CS5201−1GT3
CS5201−1GDP3
CS5201−1GDPR3
1.0 A, Adj. Output
1.0 A, Adj. Output
1.0 A, Adj. Output
TO−220−3, STRAIGHT
D2PAK−3
D2PAK−3
50 Units / Rail
50 Units / Rail
750 / Tape & Reel
CS5201−1GST3
1.0 A, Adj. Output
SOT−223
80 Units / Rail
CS5201−1GSTR3
1.0 A, Adj. Output
SOT−223
2500 / Tape & Reel
CS5201−1GSTR3G
1.0 A, Adj. Output
SOT−223
(Pb−Free)
2500 / Tape & Reel
*Consult your local sales representative for fixed output voltage versions.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
TO−220−3
T SUFFIX
CASE 221A
CS
5201−1
AWLYWW
1
MARKING DIAGRAMS
D2PAK−3
DP SUFFIX
CASE 418AB
CS
5201−1
AWLYWW
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
SOT−223
ST SUFFIX
CASE 318E
ALYW
201−1
1
PACKAGE THERMAL DATA
Parameter
TO−220−3
D2PAK−3
SOT−223
RqJC
Typical
3.5
3.5
15
RqJA
Typical
50
10−50*
156
* Depending on thermal properties of substrate. RqJA = RqJC + RqCA
Unit
°C/W
°C/W
http://onsemi.com
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