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AD8023AR Datasheet PDF : 11 Pages
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AD8023
Model
POWER SUPPLY (Continued)
Power Supply Rejection Ratio
Input Offset Voltage
–Input Current
+Input Current
DISABLE CHARACTERISTICS
Off Isolation
Off Output Capacitance
Turn-On Time
Turn-Off Time
Switching Threshold
Specifications subject to change without notice.
Conditions
VS = ± 2.5 V to ± 7.5 V
f = 6 MHz
G = +1
RL = 150 Ω
AD8023A
VS
Min Typ Max
54 76
0.03
0.07
–70
12
50
30
VTH – VEE
1.6
Units
dB
dB
µA/V
µA/V
dB
pF
ns
ns
V
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 15.5 V Total
Internal Power Dissipation
Small Outline (R) . . . . 1.0 Watts (Observe Derating Curves)
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . ± 3 V (Clamped)
Output Voltage Limit
Maximum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +VS
Minimum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range
R Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +125°C
Operating Temperature Range
AD8023A . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
ORDERING GUIDE
Model
Temperature Package
Range
Description
Package
Option
AD8023AR
–40°C to +85°C
AD8023AR-
–40°C to +85°C
REEL
AD8023AR-
–40°C to +85°C
REEL7
AD8023ACHIPS –40°C to +85°C
14-Lead Plastic SOIC
13" Tape and Reel
7" Tape and Reel
Die
R-14
R-14
R-14
Maximum Power Dissipation
The maximum power that can be safely dissipated by the AD8023
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for the plastic encapsulated
parts is determined by the glass transition temperature of the
plastic, about 150°C. Temporarily exceeding this limit may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of 175°C for an extended period can result in
device failure.
While the AD8023 is internally short circuit protected, this may
not be enough to guarantee that the maximum junction temper-
ature is not exceeded under all conditions. To ensure proper
operation, it is important to observe the derating curves.
It must also be noted that in (noninverting) gain configurations
(with low values of gain resistor), a high level of input overdrive
can result in a large input error current, which may result in a
significant power dissipation in the input stage. This power
must be included when computing the junction temperature rise
due to total internal power.
2.5
TJ = +150؇C
2.0
1.5
14-LEAD SOIC
1.0
0.5
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 3. Maximum Power Dissipation vs. Ambient
Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8023 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recom-
mended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–3–
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