HCPL-7800B-500 Ver la hoja de datos (PDF) - HP => Agilent Technologies
Número de pieza
componentes Descripción
Fabricante
HCPL-7800B-500 Datasheet PDF : 17 Pages
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Gull Wing Surface Mount Option 300*
MOLDED
1.19
(0.047)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
PIN LOCATION (FOR REFERENCE ONLY)
1.02 (0.040)
1.19 (0.047)
8
7
6
5
HP 7800
YYWW
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
4
(04..18930)TYP.
9.65 ± 0.25
(0.380 ± 0.010)
1.19 (0.047)
1.78 (0.070)
0.380 (0.015)
0.635 (0.025)
1.780
(0.070)
MAX.
(04..11695)MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.20 (0.008)
0.33 (0.013)
1.080 ± 0.320
(0.043 ± 0.013)
2.540
(0.100)
BSC
0.51 ± 0.130
(0.020 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01
xx.xxx = 0.005
* REFER TO OPTION 300 DATA SHEET FOR MORE INFORMATION.
12° NOM.
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T = 115°C, 0.3°C/SEC
∆T = 100°C, 1.5°C/SEC
1
23
4
5
6
7
8
TIME – MINUTES
∆T = 145°C, 1°C/SEC
9 10 11 12
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
1-218
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