HCPL-543K-100 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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componentes Descripción

Fabricante

HCPL-543K-100

Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

HP => Agilent Technologies 

Leaded Device Marking

Leadless Device Marking

HP LOGO

HP P/N

DESC SMD*

DESC SMD*

PIN ONE/

ESD IDENT

HP QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COMPLIANCE INDICATOR,*

HP LOGO

DATE CODE, SUFFIX (IF NEEDED)

HP P/N

PIN ONE/

COUNTRY OF MFR.

ESD IDENT

HP FSCN*

COUNTRY OF MFR.

HP QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

DESC SMD*

DESC SMD*

HP FSCN*

* QUALIFIED PARTS ONLY

* QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

100

Description

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details).

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.14 (0.045)

1.40 (0.055)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

7.36 (0.290)

7.87 (0.310)

200 Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead

finish. All leadless chip carrier devices are delivered with solder dipped terminals as a

standard feature.

300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details). This option has solder dipped leads.

5.57 (0.180)

MAX.

0.51 (0.020)

MIN.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

0.51 (0.020)

MAX.

5° MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

0.20 (0.008)

0.33 (0.013)

9.65 (0.380)

9.91 (0.390)

5.57 (0.180)

MAX.

1-527

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