5962-8957001YA Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza

componentes Descripción

Fabricante

5962-8957001YA

Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

HP => Agilent Technologies 

Functional Diagrams

8 Pin DIP

Through Hole

1 Channel

1

VCC 8

2

VE 7

3

6

VO

4

5

GND

8 Pin DIP

Through Hole

2 Channels

1

VCC 8

VO1

2

7

VO2

3

6

4

5

GND

20 Pad LCCC

Surface Mount

2 Channels

15

VCC2

19

VO2

13

20

GND2 12

2

VO1VCC1 10

3

GND1

78

Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with

separate VCC and ground connections.

Outline Drawings

20 Terminal LCCC Surface Mount, 2 Channels

1.78 (0.070)

2.03 (0.080)

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

1.52 (0.060)

2.03 (0.080)

0.64

(0.025)

(20 PLCS)

1.02 (0.040) (3 PLCS)

1.14 (0.045)

1.40 (0.055)

TERMINAL 1 IDENTIFIER

2.16 (0.085)

METALIZED

CASTILLATIONS (20 PLCS)

0.51 (0.020)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

8 Pin DIP Through Hole, 1 and 2 Channel

9.40 (0.370)

9.91 (0.390)

0.76 (0.030)

1.27 (0.050)

4.32 (0.170)

MAX.

0.51 (0.020)

MIN.

3.81 (0.150)

MIN.

8.13 (0.320)

MAX.

7.16 (0.282)

7.57 (0.298)

0.20 (0.008)

0.33 (0.013)

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

7.36 (0.290)

7.87 (0.310)

1-526

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