HCPL-257K-300 Ver la hoja de datos (PDF) - HP => Agilent Technologies
Número de pieza
componentes Descripción
Fabricante
HCPL-257K-300
HP => Agilent Technologies
HCPL-257K-300 Datasheet PDF : 12 Pages
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Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
1
VB1 16
1
2
VOC1 15
2
3
VO1 14
3
4
GND 13
4
5
VB2 12
6
VCC2 11
7
GND 10
8
VO2 9
VCC
8
1
VB
7
2
VOUT
6
3
5
4
GND
VCC
8
VO1
7
VO2
6
5
GND
16 Pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15 14
1
16
VCC2 VB2
2
VCC 15
19
VO2 13
20
GND2 12
3
VO1 14
2
VO1VCC1 10
4
VO2 13
3
VB1 9
GND1
5
VO3 12
78
6
VO4 11
7
GND 10
8
9
Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages
have isolated channels with separate VCC and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
0.51 (0.020)
MIN.
4.45 (0.175)
MAX.
3.81 (0.150)
MIN.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8.13 (0.320)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Leaded Device Marking
Leadless Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
* 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
HP LOGO
HP P/N
PIN ONE/
COUNTRY OF MFR.
ESD IDENT
HP FSCN*
COUNTRY OF MFR.
* QUALIFIED PARTS ONLY
HP QYYWWZ
XXXXXX
* XXXX
XXXXXX
USA 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DESC SMD*
DESC SMD*
HP FSCN*
*QQUUAALLIFIFIEIEDDPPAARTRSTSONOLNYLY
1-561
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