CX28HC64DMB-12(2006) Ver la hoja de datos (PDF) - Intersil
Número de pieza
componentes Descripción
Fabricante
CX28HC64DMB-12 Datasheet PDF : 17 Pages
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X28HC64
Ordering Information (Continued)
PART NUMBER
PART MARKING
TEMPERATURE ACCESS TIME
RANGE (°C)
(ns)
PACKAGE
PKG. DWG. #
X28HC64D-12
X28HC64D-12
0 to 70
120
28 Ld CERDIP
X28HC64DI-12
X28HC64DI-12
-40 to 85
28 Ld CERDIP
X28HC64DM-12
X28HC64DM-12
-55 to 125
28 Ld CERDIP
X28HC64DMB-12
C X28HC64DMB-12
MIL-STD-883
28 Ld CERDIP
X28HC64FM-12
X28HC64FM-12
-55 to 125
28 Ld FLATPACK (440 mil)
X28HC64J-12*
X28HC64J-12
0 to 70
32 Ld PLCC
N32.45x55
X28HC64JI-12*
X28HC64JI-12
-40 to 85
32 Ld PLCC
N32.45x55
X28HC64JIZ-12* (Note) X28HC64JI-12 Z
-40 to 85
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64JZ-12* (Note) X28HC64J-12 Z
0 to 70
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64KMB-12
C X28HC64KMB-12
MIL-STD-883
28 Ld PGA
G28.550x650A
X28HC64P-12
X28HC64P-12
0 to 70
28 Ld PDIP
E28.6
X28HC64PI-12
X28HC64PI-12
-40 to 85
28 Ld PDIP
E28.6
X28HC64PIZ-12 (Note) X28HC64PI-12 Z
-40 to 85
28 Ld PDIP** (Pb-free)
E28.6
X28HC64PZ-12 (Note) X28HC64P-12 Z
0 to 70
28 Ld PDIP** (Pb-free)
E28.6
X28HC64S-12*
X28HC64S-12
0 to 70
28 Ld SOIC (300 mil)
M28.3
X28HC64SI-12*
X28HC64SI-12
-40 to 85
28 Ld SOIC (300 mil)
M28.3
X28HC64SIZ-12* (Note) X28HC64SI-12 Z
-40 to 85
28 Ld SOIC (300 mil) (Pb-free) M28.3
X28HC64SZ-12 (Note) X28HC64S-12 Z
0 to 70
28 Ld SOIC (300 mil) (Pb-free) M28.3
X28HC64DM-15
X28HC64DM-15
-55 to 125
150
28 Ld CERDIP
X28HC64J-15T1
X28HC64J-15
0 to 70
32 Ld PLCC Tape and Reel N32.45x55
X28HC64JI-15
X28HC64JI-15
-40 to 85
32 Ld PLCC
N32.45x55
X28HC64JM-15
X28HC64JM-15
-55 to 125
32 Ld PLCC
N32.45x55
X28HC64JZ-15* (Note) X28HC64J-15 Z
0 to 70
32 Ld PLCC (Pb-free)
N32.45x55
X28HC64KMB-15
C X28HC64KMB-15
MIL-STD-883
28 Ld PGA
G28.550x650A
X28HC64P-15
X28HC64P-15
0 to 70
28 Ld PDIP
E28.6
X28HC64PIZ-15 (Note) X28HC64PI-15 Z
-40 to 85
28 Ld PDIP** (Pb-free)
E28.6
X28HC64PZ-15 (Note) X28HC64P-15 Z
0 to 70
28 Ld PDIP** (Pb-free)
E28.6
X28HC64S-15
X28HC64S-15
0 to 70
28 Ld SOIC (300 mil)
M28.3
X28HC64SI-15
X28HC64SI-15
-40 to 85
28 Ld SOIC (300 mil)
M28.3
*Add "T1" suffix for tape and reel.
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3
FN8109.1
June 7, 2006
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