GO1515-CTA Ver la hoja de datos (PDF) - Gennum -> Semtech
Número de pieza
componentes Descripción
Fabricante
GO1515-CTA Datasheet PDF : 4 Pages
| |||
DIMENSIONS
NC
GND
VCTR
GND
65
OUT
55
55
40
GO1515
TOP VIEW
GND
65
40
45
GND
VCC
All dimensions are in mils
1 mil = 1/1000 inch
Fig. 1 Footprint of the GO1515
NC
GND
OUT
GND
GO1515
TOP VIEW
GND
VCTR
GND
VCC
2.0 4.2 6.0
±0.3 ±0.3 MAX
1.6±0.5
4.7±0.3
6.3±0.3
7.8 MAX
2.0 MAX
All dimensions in millimetres.
SOLDERING RECOMMENDATIONS
Reflow Conditions
The device will meet the data sheet specifications after
completing the reflow process according to the profile
shown in Figure 3. Do not reflow the device more than
twice.
Endurance To Warp
When the device is soldered on a printed circuit board
(dimension: 100mm x 100mm; thickness: 1.6mm) and the
PCB is warped as shown in Figure 2, the device will not be
cracked or damaged.
PCB
VCO
MAX 2mm
Fig. 3 PCB Warp
Soldering Conditions
Recommended soldering conditions are as follows:
Reflow Soldering
Preheating 150±10°C, 60 to 120 sec.
Soldering
Peak 230±5°C
Over 200°C within 30 sec.
Soldering Flux
Do not use cleaning type flux. Washing the devices after
using cleaning type flux may damage inner parts and affect
performance.
Solder Type
Use solder H60, H63 (in JIS Z 3282) or an equivalent type.
This also applies to solder paste.
3
522 - 40 - 02
Share Link: 