TE28F800C3BA90 Ver la hoja de datos (PDF) - Intel

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TE28F800C3BA90

Intel Advanced+ Boot Block Flash Memory (C3)

Intel 

Contents

Revision History

Date of

Revision

05/12/98

07/21/98

10/03/98

12/04/98

12/31/98

02/24/99

06/10/99

03/20/00

04/24/00

10/12/00

7/20/01

10/02/01

2/05/02

Version

-001

-002

-003

-004

-005

-006

-007

-008

-009

-010

-011

-012

-013

Description

Original version

48-Lead TSOP package diagram change

µBGA package diagrams change

32-Mbit ordering information change (Section 6)

CFI Query Structure Output Table Change (Table C2)

CFI Primary-Vendor Specific Extended Query Table Change for Optional

Features and Command Support change (Table C8)

Protection Register Address Change

IPPD test conditions clarification (Section 4.3)

µBGA package top side mark information clarification (Section 6)

Byte-Wide Protection Register Address change

VIH Specification change (Section 4.3)

VIL Maximum Specification change (Section 4.3)

ICCS test conditions clarification (Section 4.3)

Added Command Sequence Error Note (Table 7)

Datasheet renamed from 3 Volt Advanced Boot Block, 8-, 16-, 32-Mbit Flash

Memory Family.

Added tBHWH/tBHEH and tQVBL (Section 4.6)

Programming the Protection Register clarification (Section 3.4.2)

Removed all references to x8 configurations

Removed reference to 40-Lead TSOP from front page

Added Easy BGA package (Section 1.2)

Removed 1.8 V I/O references

Locking Operations Flowchart changed (Appendix B)

Added tWHGL (Section 4.6)

CFI Primary Vendor-Specific Extended Query changed (Appendix C)

Max ICCD changed to 25 µA

Table 10, added note indicating VCCMax = 3.3 V for 32-Mbit device

Added specifications for 0.18 micron product offerings throughout document

Added 64-Mbit density

Changed references of 32Mbit 80ns devices to 70ns devices to reflect the

faster product offering.

Changed VccMax=3.3V reference to indicate that the affected product is the

0.25µm 32Mbit device.

Minor text edits throughout document.

Added 1.8v I/O operation documentation where applicable

Added TSOP PCN ‘Pin-1’ indicator information

Changed references in 8 x 8 BGA pinout diagrams from ‘GND’ to ‘Vssq’

Added ‘Vssq’ to Pin Descriptions Information

Removed 0.4 µm references in DC characteristics table

Corrected 64Mb package Ordering Information from 48-uBGA to 48-VFBGA

Corrected ‘bottom’ parameter block sizes to on 8Mb device to 8 x 4KWords

Minor text edits throughout document

Added specifications for 0.13 micron product offerings throughout document

Corrected Iccw / Ippw / Icces /Ippes values.

Added mechanicals for 16Mb and 64Mb

Minor text edits throughout document.

Datasheet

5

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