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S10PF30L Ver la hoja de datos (PDF) - STMicroelectronics

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S10PF30L Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
STS10PF30L
Table 4: THERMAL DATA
Rthj-amb (*) Thermal Resistance Junction-ambient
Max
Rthj-lead Thermal Resistance Junction-leads
Max
Tl
Maximum Lead Temperature For Soldering Purpose
Typ
Tstg
storage temperature
(*) When Mounted on 1 inch2 FR-4 board, 2 oz of Cu and t 10 sec.
47
16
150
-55 to 150
°C/W
°C/W
°C
°C
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
Table 5: OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
30
V
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
±100
nA
Table 6: ON (*)
Symbol
Parameter
VGS(th) Gate Threshold Voltage
RDS(on)
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 4.5 V
ID = 5 A
ID = 5 A
Min.
1
Typ. Max.
0.012 0.014
0.015 0.018
Unit
V
Table 7: DYNAMIC
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
gfs
Forward Transconductance VDS = 10 V
ID = 5 A
31
S
Ciss
Input Capacitance
VDS = 25V, f = 1 MHz, VGS = 0
2300
pF
Coss
Output Capacitance
750
pF
Crss
Reverse Transfer
Capacitance
115
pF
2/9

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