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SMH4811

Distributed Power Hot-Swap Controller

Summit Microelectronics 

SMH4811A

DESCRIPTION

The SMH4811A is designed to control hot swapping of

plug-in cards operating from a single supply ranging from

20V to 500V. The SMH4811A hot-swap controller pro-

vides under-voltage and over-voltage monitoring of the

host power supply, it drives an external power MOSFET

switch that connects the supply to the load, and also

protects against over-current conditions that might disrupt

the host supply. When the input and output voltages to the

SMH4811A controller are within specification, it provides

a Power Good logic output that may be used to turn the

loads on (e.g., an isolated-output DC-DC converter, or

drive a LED status light). Additional features of the

SMH4811A include: temperature sense or master enable

input, 2.5V and 5V reference outputs for expanding moni-

tor functions, two Pin-Detect enable inputs for fault protec-

tion, and a duty-cycle over-current protection.

PIN CONFIGURATION

16-Pin SOIC

DRAIN SENSE 1

VGATE 2

EN/TS 3

PD1# 4

PD2# 5

CBFAULT# 6

CBSENSE 7

VSS 8

16 VDD

15 PG#

14 ENPG

13 NC

12 2.5VREF

11 5VREF

10 OV

9 UV

2044 SOIC PCon 4.0

ABSOLUTE MAXIMUM RATINGS*

Temperature Under Bias ...................... –55°C to 125°C

Storage Temperature ........................... –65°C to 150°C

Lead Solder Temperature (10 secs) ................... 300 °C

Terminal Voltage with Respect to VSS:

VDD ................................. –0.5V to VDD

OV, UV, DRAIN SENSE,

CBSENSE ........... –0.5V to VDD+0.5V

PD1#, PD2#, ENPG, EN/TS ......... 10V

CBFAULT, PG# ..... –0.5V to VDD+0.5V

VGATE ................................ VDD+0.5V

*COMMENT

Stresses listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions

outside those listed in the operational sections of this specification is not

implied. Exposure to any absolute maximum rating for extended

periods may affect device performance and reliability.

2044 4.1 8/1/00

SUMMIT MICROELECTRONICS, Inc.

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