RMPA0913C-58 Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Fabricante

RMPA0913C-58

3.5V AMPS/CDMA Power Amplifier

Unspecified 

R aytheon Commercial E lectronics

RMPA0913C-58

3.5V AMPS/CDMA Power Amplifier

Table 1: Further Important Application Information (cont’d)

Pin#

Function

Application hints

6

G1 AC GND

7

GND

8

RF IN

9

GND

10

VD1

11

VG2

12

VG1

Place components R1 and C11 < 0.080 inches from the

package pin.

Same as pin 5.

The amplifier input is optimally matched to 50 ohms by

locating capacitor C2 at a distance of 0.138 inches from

the package pin. If it is not possible to obtain this

separation, adjust the value of inductor L1 to

compensate and obtain the desired match.

Same as pin 5.

Place component C3 < 0.080 inches from the package

pin. The dc resistance of inductor L2 should be <= 0.5

ohms to obtain optimum amplifier performance. Also,

connect VD1 and VD2 at the board component surface

and route VG1 and VG2 bias lines to other conductor

layers to minimize any additional ohmic losses on the

drain supply line.

Connect to a low impedance negative voltage power

supply for stage 2 current control. From pinchoff, adjust

VG2 voltage to achieve 155mA of stage 2 current, ID2.

This current is optimum for high power CDMA operation

up to 28.5dBm output power. For improved

performance, adjust to lower current for low power

CDMA and analog modes of operation. Since both stage

1 and stage 2 drains contribute to the total amplifier

current the first stage must be pinched off while

adjusting VG2 for a specific ID2 current. A pinchoff

condition is achieved by applying -2.0 to -5.0 volts to the

gate pins, VG1 and VG2.

Connect to a low impedance negative voltage power

supply for stage 1 current control, ID1. From pinchoff,

adjust VG1 voltage to achieve 35mA of stage 1 current.

13

PACKAGE BASE AND GND The solder pad for this package should be 0.210 inches

square. Fill the pad with several plated-thru vias

connecting the pad surface to the RF input and output

ground planes. Insufficient grounding of the package

base may cause the amplifier to oscillate or result in

poor amplifier performance.

Raytheon reserves the right to update or change specifications without notice.

Tel: 978-684-8663

FAX: 978-684-5480

www.raytheon.com/micro

Revised March 30,2000

Page 8

Raytheon RF Components

362 Lowell Street

Andover, MA 01810

Share Link: