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RH56D-PCI Datasheet PDF : 60 Pages
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RH56D-PCI Modem Designer’s Guide
3. HARDWARE INTERFACE ................................................................................................................................. 3-1
3.1 HARDWARE SIGNAL PINS AND DEFINITIONS ..................................................................................... 3-1
3.2 POWER REQUIREMENTS AND MAXIMUM RATINGS......................................................................... 3-13
3.3 MDP ELECTRICAL CHARACTERISTICS.............................................................................................. 3-14
3.4 PCI BUS ELECTRICAL, SWITCHING, AND TIMING CHARACTERISTICS.......................................... 3-14
4. DESIGN CONSIDERATIONS ............................................................................................................................. 4-1
4.1 PC BOARD LAYOUT GUIDELINES......................................................................................................... 4-1
4.1.1 General Principles...................................................................................................................... 4-1
4.1.2 Component Placement............................................................................................................... 4-1
4.1.3 Signal Routing............................................................................................................................ 4-2
4.1.4 Power ......................................................................................................................................... 4-3
4.1.5 Ground Planes ........................................................................................................................... 4-4
4.1.6 Crystal Circuit............................................................................................................................. 4-4
4.1.7 VC and VREF Circuit ................................................................................................................. 4-4
4.1.8 Telephone and Local Handset Interface .................................................................................... 4-5
4.1.9 Optional Configurations ............................................................................................................. 4-5
4.1.10 MDP Specific.............................................................................................................................. 4-5
4.2 CUSTOM DESIGN GUIDELINES FOR 2-LAYER PCI MODEM BOARD ................................................. 4-5
4.2.1 General Guidelines .................................................................................................................... 4-5
4.2.2 Placement of Modem Devices ................................................................................................... 4-6
4.2.3 Trace Routing and Length on PCI Signals................................................................................. 4-6
4.2.4 Grounding .................................................................................................................................. 4-6
4.2.5 Filtering ...................................................................................................................................... 4-6
4.2.6 Decoupling ................................................................................................................................. 4-7
4.2.7 Crystal Circuit............................................................................................................................. 4-7
4.2.8 Modem Analog Interface ............................................................................................................ 4-8
4.3 PCB LAYOUT EXAMPLES....................................................................................................................... 4-9
4.4 CRYSTAL/OSCILLATOR SPECIFICATIONS ........................................................................................ 4-11
4.5 OTHER CONSIDERATIONS.................................................................................................................. 4-11
4.6 PACKAGE DIMENSIONS....................................................................................................................... 4-14
5. SOFTWARE INTERFACE .................................................................................................................................. 5-1
5.1 PCI CONFIGURATION REGISTERS....................................................................................................... 5-1
5.1.1 0x00 - Vendor ID Field ............................................................................................................... 5-1
5.1.2 0x02 - Device ID Field................................................................................................................ 5-1
5.1.3 0x04 - Command Register ......................................................................................................... 5-2
5.1.4 0x06 - Status Register ............................................................................................................... 5-2
5.1.5 0x08 - Revision ID Field............................................................................................................. 5-3
5.1.6 0x09 - Class Code Field............................................................................................................. 5-3
5.1.7 0x0D - Latency Timer Register .................................................................................................. 5-3
5.1.8 0x0E - Header Type Field .......................................................................................................... 5-3
5.1.9 0x28 - CIS Pointer Register ....................................................................................................... 5-3
5.1.10 0x2C - Subsystem Vendor ID Register ...................................................................................... 5-3
5.1.11 0x2E- Subsystem ID Register .................................................................................................... 5-3
5.1.12 0x34 - Cap Ptr ............................................................................................................................ 5-3
5.1.13 0x3C - Interrupt Line Register .................................................................................................... 5-3
5.1.14 0x3D - Interrupt Pin Register...................................................................................................... 5-3
5.1.15 0x3E - Min Grant Register.......................................................................................................... 5-3
5.1.16 0x3F - Max Latency Register ..................................................................................................... 5-3
5.1.17 0x40 - Capability Identifier ......................................................................................................... 5-3
5.1.18 0x41 - Next Item Pointer ............................................................................................................ 5-3
5.1.19 0x42 - PMC - Power Management Capabilities ......................................................................... 5-4
5.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 5-4
5.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 5-4
5.1.22 0x47 - Data ................................................................................................................................ 5-4
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