NIS6111
MAXIMUM RATINGS (TJ = 25°C, unless otherwise noted.)
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage (VK to VA)
Peak Regulator Input (Reg In) Voltage
Average Rectified Forward Current
Non−repetitive Peak Surge Current
Analog Die Thermal Resistance (Min Copper Area)
MOSFET Die Thermal Resistance (Min Copper Area)
Analog Die Thermal Resistance (Junction−to−Top of Board)
MOSFET Die Thermal Resistance (Junction−to−Top of Board)
Analog Die Thermal Resistance (Junction−to−Bottom of Board) (Note 4)
MOSFET Die Thermal Resistance (Junction−to−Bottom of Board) (Note 4)
Storage Temperature Range
Operating Temperature Range
VRRM
Vregmax
IFAV
IFSM
qA j−a
qM j−a
qA j−t
qM j−t
qA j−b
qM j−b
Tstg
TJ
24
28
30
90
83
78
4.9
0.6
30
7.0
−55 to 150
−40 to 125
V
V
A
A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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