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NIS3001 Datasheet PDF : 18 Pages
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NIS3001
Integrated Driver and
MOSFET Power Chip for
Synchronous Buck
Controllers
The NIS3001 is an integrated multi−chip solution for high power
DC to DC synchronous buck converters. It contains two power
MOSFETs that are controlled by an internal Driver. All three die are
packaged in a power QFN package called PInPAK™. The 10.5 by
10.5 mm PInPAK™ package increases power density and simplifies
PCB layout. The device can be used in single or multi−phase
applications.
The NIS3001 implements the newest MOSFET technology. The
control MOSFET is designed to provide improved switching
performance and operates at a much lower temperature compared to
discrete solutions. The synchronous MOSFET is designed to reduce
conduction and switching losses at high frequencies. The integrated
solution greatly reduces the parasitic inductance associated with
conventional discrete buck converters and results in the highest
power conversion efficiency.
The power density of the NIS3001 is optimized based on MOSFET
die size and PInPAK design. The PInPAK layout allows for direct
routing into each power terminal. This results in a better thermal
solution for the system. In addition its thermal resistance is 50%
lower than BGAs. In summary, the NIS3001 has an improved
efficiency, reliability and scalability for multi−phase synchronous
buck converters.
Features
• Matched MOSFETs for Optimal Efficiency
• 10.5 mm x 10.5 mm Power QFN Package, PInPAK
• 25 A DC Output Current
• 7.0 to 14 V Input Voltage Range
• Internal Thermal Shutdown
• Operating Frequency Range up to 1,000 kHz
• 0.7 V to 5.1 V Output Voltage Range
• Nominal Duty−Cycle 5% to 50%
Hi Side
Discrete
Analog
FETs
VS
Driver
IC
Lo Side
Discrete
FETs
VIN
DRN
PGND
http://onsemi.com
MARKING
DIAGRAM
CASE 500
PInPAK
10.5x10.5 PLLP
NIS3001QP
AWLYYWW
NIS3001 = Specific Device Code
A = Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
PINOUT DIAGRAM
14 15 16 17
11 12
10
13 18
1
19
2
20
3
4
7
21
5
9
8
6
(Bottom View)
ORDERING INFORMATION
Device
Package
Shipping†
NIS3001QPT1 PInPAK 1500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Figure 1.
© Semiconductor Components Industries, LLC, 2003
1
October, 2003 − Rev. 5
Publication Order Number:
NIS3001/D
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