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MPX5700 Ver la hoja de datos (PDF) - Motorola => Freescale

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MPX5700 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MPX5700 SERIES
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 3 illustrates both the Differential/Gauge and the Ab-
solute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm. (For use of the
MPX5700D in a high pressure, cyclic application, consult the
factory.)
The MPX5700 series pressure sensor operating character-
istics, and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media, other than dry
air, may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information re-
garding media compatibility in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the sensor to the A/D input of a microprocessor. Proper de-
coupling of the power supply is recommended.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
5.0
TRANSFER FUNCTION:
4.5 Vout = VS*(0.0012858*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
3.5 TEMP = 0 to 85°C
3.0
TYPICAL
2.5
2.0
1.5 MAX
MIN
1.0
0.5
0
0 100 200 300 400 500 600 700 800
DIFFERENTIAL PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
FLUORO SILICONE
DIE COAT
STAINLESS STEEL
WIRE BOND
LEAD
FRAME
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉDIÉÉÉÉÉE PÉÉÉÉÉ1 ÉÉÉÉÉÉÉÉÉÉMÉÉÉÉÉETALÉÉÉÉÉCOVÉÉÉÉÉERRBTOVNDDIE
P2
EPOXY CASE
Figure 3. Cross–Sectional Diagram
(Not to Scale)
MPX5700
OUTPUT
(PIN 1)
50 pF
A/D
51 k
µ PROCESSOR
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Motorola Sensor Device Data
3

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