MMBT3416LT3 Ver la hoja de datos (PDF) - ON Semiconductor
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MMBT3416LT3 Datasheet PDF : 7 Pages
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MMBT3416LT3
1.0
0.7
0.5
D = 0.5
0.3
0.2
0.2
0.1
0.1
0.07
0.05
0.05
0.02
0.03
0.02
0.01
SINGLE PULSE
0.01
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0
P(pk)
FIGURE 19A
t1
t2
DUTY CYCLE, D = t1/t2
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1 (SEE AN−569)
ZqJA(t) = r(t) w RqJA
TJ(pk) − TA = P(pk) ZqJA(t)
5.0 10 20 50 100 200
t, TIME (ms)
500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100
Figure 19. Thermal Response
104
VCC = 30 Vdc
103
102
ICEO
101
100
ICBO
AND
10−1
ICEX @ VBE(off) = 3.0 Vdc
10−2
−4 −2
00
0 + 20 + 40 + 60 + 80 + 100 + 120 + 140 + 160
TJ, JUNCTION TEMPERATURE (°C)
Figure 19A.
DESIGN NOTE: USE OF THERMAL RESPONSE DATA
A train of periodical power pulses can be represented by the
model as shown in Figure 19A. Using the model and the device
thermal response the normalized effective transient thermal
resistance of Figure 19 was calculated for various duty cycles.
To find ZqJA(t), multiply the value obtained from Figure 19 by the
steady state value RqJA.
Example:
The MPS3904 is dissipating 2.0 W peak under the following
conditions:
t1 = 1.0 ms, t2 = 5.0 ms. (D = 0.2)
Using Figure 19 at a pulse width of 1.0 ms and D = 0.2, the
reading of r(t) is 0.22.
The peak rise in junction temperature is therefore
DT = r(t) x P(pk) x RqJA = 0.22 x 2.0 x 200 = 88°C.
For more information, see AN−569.
400
200
100
60
40
20
10
6.0
4.0
2.0
1.0 ms 100 ms
TC = 25°C
TA = 25°C
dc
10 ms
1.0 s
dc
TJ = 150°C
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
4.0 6.0 8.0 10
20
VCE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 20.
The safe operating area curves indicate IC−VCE limits of the
transistor that must be observed for reliable operation. Collector
load lines for specific circuits must fall below the limits indicated
by the applicable curve.
The data of Figure 20 is based upon TJ(pk) = 150°C; TC or TA
is variable depending upon conditions. Pulse curves are valid for
duty cycles to 10% provided TJ(pk) ≤ 150°C. TJ(pk) may be
calculated from the data in Figure 19. At high case or ambient
temperatures, thermal limitations will reduce the power that can
be handled to values less than the limitations imposed by second
breakdown.
40
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