MC10EP08DTR2G Ver la hoja de datos (PDF) - ON Semiconductor
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MC10EP08DTR2G Datasheet PDF : 11 Pages
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MC10EP08, MC100EP08
PACKAGE DIMENSIONS
DFN8
CASE 506AA
ISSUE E
D
A
B
2X
PIN ONE
REFERENCE
0.10 C
ÇÇÇÇÇÇ
E
2X
0.10 C
TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
(A3)
A1
SIDE VIEW
L
L
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉÉÉ EXPOSED Cu
MOLD CMPD
A
DETAIL B
OPTIONAL
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D
2.00 BSC
D2 1.10 1.30
E
2.00 BSC
E2 0.70 0.90
e
0.50 BSC
K
0.30 REF
L 0.25 0.35
L1 −−− 0.10
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
D2
1
4
8X L
PACKAGE
OUTLINE
1.30
8X
0.50
E2
K
8
e/2
e
5
8X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
0.90
2.30
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
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