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MC10EP08DG Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
MC10EP08DG Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
MC10EP08, MC100EP08
D0 1
D0 2
D1 3
8 VCC
7Q
6Q
D1 4
5
VEE
Figure 1. 8Lead Pinout (Top View) and Logic Diagram
Table 1. PIN DESCRIPTION
PIN
FUNCTION
D0, D1, D0, D1
Q, Q
VCC
VEE
EP
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal exposed pad
must be connected to a sufficient
thermal conduit. Electrically connect
to the most negative supply (GND) or
leave unconnected, floating open.
Table 2. TRUTH TABLE
D0*
D1* D0** D1** Q
Q
L
L
H
H
L
H
L
H
H
L
H
L
H
L
L
H
H
L
H
H
L
L
L
H
* Pins will default LOW when left open.
** Pins will default to 0.666% of VCC when left open.
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC8
TSSOP8
DFN8
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Value
75 kW
37.5 kW
> 4 kV
> 200 V
> 2 kV
Pb Pkg
PbFree Pkg
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
UL 94 V0 @ 0.125 in
135 Devices
http://onsemi.com
2

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