MBR1035 Ver la hoja de datos (PDF) - Motorola => Freescale
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MBR1035 Datasheet PDF : 6 Pages
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MBR1035 MBR1045
HIGH FREQUENCY OPERATION
Since current flow in a Schottky rectifier is the result of majority
carrier conduction, it is not subject to junction diode forward and
reverse recovery transients due to minority carrier injection and
stored charge. Satisfactory circuit analysis work may be performed
by using a model consisting of an ideal diode in parallel with a
variable capacitance. (See Figure 10.)
Rectification efficiency measurements show that operation will
be satisfactory up to several megahertz. For example, relative
waveform rectification efficiency is approximately 70 percent at
2.0 MHz, e.g., the ratio of dc power to RMS power in the load is
0.28 at this frequency, whereas perfect rectification would yield
0.406 for sine wave inputs. However, in contrast to ordinary
junction diodes, the loss in waveform efficiency is not indicative of
power loss; it is simply a result of reverse current flow through the
diode capacitance, which lowers the dc output voltage.
1500
1000
700
500
MAXIMUM
300
TYPICAL
200
150
0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20
50
VR, REVERSE VOLTAGE (VOLTS)
Figure 10. Capacitance
SCHOTTKY CHIP (See View A–A)
ANODE
ALUMINUM WIRE
3
1
4
COPPER
CATHODE
SOLDER DIPPED
COPPER LEADS
UL RATED EPOXY
Figure 11. Schottky Rectifier
SCHOTTKY CHIP — View A–A
ALUMINUM CONTACT METAL
PLATINUM BARRIER METAL
OXIDE
PASSIVATION
GUARDRING
Motorola builds quality and reliability into its Schottky Rectifiers.
First is the chip, which has an interface metal between the
barrier metal and aluminum–contact metal to eliminate any
possible interaction between the two. The indicated guardring
prevents dv/dt problems, so snubbers are not mandatory. The
guardring also operates like a zener to absorb over–voltage
transients.
Second is the package. The Schottky chip is bonded to the
copper heat sink using a specially formulated solder. This gives the
unit the capability of passing 10,000 operating thermal–fatigue
cycles having a DTJ of 100°C. The epoxy molding compound is
rated per UL 94, V0 @ 1/8″. Wire bonds are 100% tested in
assembly as they are made.
Third is the electrical testing, which includes 100% dv/dt at 1600
V/ms and reverse avalanche as part of device characterization.
12 V
2.0 µs
1.0 kHz
VCC 12 Vdc
100
2N2222
CURRENT
AMPLITUDE
ADJUST
0–10 AMPS
100
CARBON
+150 V, 10 mAdc
2.0 kΩ
D.U.T.
+
4.0 µF
2N6277
1.0 CARBON
1N5817
Figure 12. Test Circuit for dv/dt and
Reverse Surge Current
4
Rectifier Device Data
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