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MB2M Ver la hoja de datos (PDF) - HY ELECTRONIC CORP.

Número de pieza
componentes Descripción
Fabricante
MB2M
HY
HY ELECTRONIC CORP. HY
MB2M Datasheet PDF : 2 Pages
1 2
MB05M thru MB10M
GLASS PASSIVATED
BRIDGE RECTIFIERS
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Reliable low cost construction utilizing
molded plastic technique results in inexpensive product
Lead tin plated copper
MECHANICAL DATA
Polarity:Symbol molded on body
Weight: 0.0044 ounces,0.125 grams
Mounting position :Any
REVERSE VOLTAGE - 50 to 1000 Volts
FORWARD CURRENT - 0.8 Ampere
MBM
~~
+-
C0.5
.051(1.3)
.035(0.9)
.165(4.2)
.146(3.7)
.031(0.8)
.019(0.5)
.106(2.7)
.090(2.3)
.193(4.9)
.177(4.5)
.014(.35)
.006(.15)
.256(6.5)
.217(5.5)
.106(2.7)
.090(2.3)
.217(5.5)
.177(4.5)
.031(0.8)
.019(0.5)
.106(2.7)
.090(2.3)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
CHARACTERISTICS
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward
Rectified Current (Note 1)
Peak Forward Surge Current
@TA=40
8.3ms Single Half Sine-Wave
Super Imposed on Rated Load(JEDEC Method)
Peak Forward Voltage at 0.8A DC
Maximum DC Reverse Current
@TJ=25
at Rated DC Bolcking Voltage
@TJ=125
Typical Junction Capacitance Per Element (Note2)
SYMBOL MB05M
VRRM
50
VRMS
35
VDC
50
I(AV)
IFSM
VF
IR
CJ
Typical Thermal Resistance (Note3)
Operating Temperature Range
RθJC
TJ
Storage Temperature Range
TSTG
NOTES:1.Mounted on P.C. board.
2.Measured at1.0MHz and applied reverse voltage of 4.0V DC.
3.Thermal resistance junction to case.
MB1M
100
70
100
MB2M
200
140
200
MB4M
400
280
400
0.8
MB6M
600
420
600
30
1.1
5.0
500
15
75
-55 to +150
-55 to +150
MB8M
800
560
800
MB10M
1000
700
1000
UNIT
V
V
V
A
A
V
μA
pF
/W
~ 372 ~

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