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MB2M Ver la hoja de datos (PDF) - General Semiconductor

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componentes Descripción
Fabricante
MB2M Datasheet PDF : 2 Pages
1 2
PATENT PENDING
PATENT PENDING
PATENT PENDING
MB2M THRU MB6M
MINIATURE GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER
Reverse Voltage - 200 to 600 Volts Forward Current - 0.5 Ampere
Case Style MBM
0.161 (4.10)
0.144 (3.65)
0.190 (4.83)
0.179 (4.55)
0.106 (2.70)
0.090 (2.30)
0.012 (0.30)
0.008 (0.20)
0.029 (0.74)
0.017 (0.43)
0.049 (1.24)
0.039 (0.99)
0.047 (1.19)
0.038 (0.96)
0.105 (2.67)
0.095 (2.41)
0.100 (2.54)
MIN.
0-10°
0.205 (5.21)
0.195 (4.95)
0.117 (2.97)
0.107 (2.72)
0.147 (3.73)
0.137 (3.48)
Dimensions in inches and (millimeters)
FEATURES
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
This series is UL recognized under Component Index,
file number E54214
Glass passivated chip junctions
High surge overload rating: 35A peak
Saves space on printed circuit board
High temperature soldering guaranteed:
260°C/10 seconds, at 5 lbs. (2.3kg) tension
0.016(0.41)
0.006 (0.15)
0.028 (0.71)
0.020 (0.51)
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any
Weight: 0.078 ounce, 0.22 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
Maximum DC blocking voltage
Maximum average forward output rectified
current at TA=30°C - on glass-epoxy P.C.B. (NOTE 1)
on aluminum substrate (NOTE 2)
Peak forward surge current 8.3msec. single half sine-
wave superimposed on rated load (JEDEC Method)
VDC
I(AV)
IFSM
Rating for fusing (t<8.3ms)
I2t
Maximum instantaneous forward voltage drop
per leg at 0.4A
VF
Maximum DC reverse current at
rated DC blocking voltage per leg
TA=25°C
TA=125°C
Typical junction capacitance per leg (NOTE 3)
Typical thermal resistance per leg
(NOTE 1)
(NOTE 1)
(NOTE 2)
Operating junction and storage temperature range
IR
CJ
RΘJL
RΘJA
RΘJA
TJ, TSTG
NOTES:
(1) On glass epoxy P.C.B. mounted on 0.05 x 0.05” (1.3 x 1.3mm) solder pads
(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8 x 0.25” (20 x 20 x 6.4mm) mounted
on 0.05 x 0.05” (1.3 x1.3mm) solder pad
(3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts
MB2M
2
200
140
200
MB4M
4
400
280
400
MB6M
6
600
420
600
0.5
0.8
35.0
5.0
1.0
5.0
500
13.0
20.0
85.0
70.0
-55 to +150
UNITS
Volts
Volts
Volts
Amp
Amps
A2sec
Volts
µA
pF
°C/W
°C

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