TZA3043 Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza

componentes Descripción

Fabricante

TZA3043

Gigabit Ethernet/Fibre Channel transimpedance amplifier

Philips Electronics 

Philips Semiconductors

Gigabit Ethernet/Fibre Channel

transimpedance amplifier

Product specification

TZA3043; TZA3043B

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

VCC

Vn

In

Ptot

Tstg

Tj

Tamb

PARAMETER

supply voltage

DC voltage

pin/pad IPhoto

pins/pads OUT and OUTQ

pad AGC (bare die only)

pin/pad DREF

DC current

pin/pad IPhoto

pins/pads OUT and OUTQ

pad AGC (bare die only)

pin/pad DREF

total power dissipation

storage temperature

junction temperature

ambient temperature

MIN.

−0.5

MAX.

+6

UNIT

V

−0.5

−0.5

−0.5

−0.5

+1

V

VCC + 0.5 V

VCC + 0.5 V

VCC + 0.5 V

−2.5

+2.5

mA

−15

+15

mA

−0.2

+0.2

mA

−2.5

+2.5

mA

−

300

mW

−65

+150

°C

−

150

°C

−40

+85

°C

HANDLING

Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during

assembly and handling of the bare die. Additional safety can be obtained by bonding the VCC and GND pads first, the

remaining pads may then be bonded to their external connections in any order.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

Rth(j-a)

thermal resistance from junction to ambient

VALUE

160

UNIT

K/W

2002 Sep 06

8

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