TZA3043 Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza

componentes Descripción

Fabricante

TZA3043

Gigabit Ethernet/Fibre Channel transimpedance amplifier

Philips Electronics 

Philips Semiconductors

Gigabit Ethernet/Fibre Channel

transimpedance amplifier

Product specification

TZA3043; TZA3043B

BONDING PAD LOCATIONS

SYMBOL

DREF

GND

GND

IPhoto

GND

GND

GND

GND

OUT

OUTQ

VCC

VCC

AGC

PAD TZA3043U

1

2

3

4

5

6

7

8

9

10

11

12

13

PAD TZA3043BU

1

2

3

4

5

6

7

8

10

9

11

12

13

COORDINATES(1)

x

y

95

881

95

618

95

473

95

285

215

95

360

95

549

95

691

95

785

501

785

641

567

1 055

424

1 055

259

1 055

Note

1. All coordinates are referenced, in µm, to the bottom left-hand corner of the die.

13 12 11

DREF 1

1300 GND 2

µm

GND 3

TZA3043U

10

9

IPhoto 4

x

0

0

y

5

6

7

8

1030

µm

OUTQ

OUT

MGU099

13 12 11

DREF 1

1300 GND 2

µm

GND 3

TZA3043BU

10

9

IPhoto 4

x

0

0

y

5

6

7

8

1030

µm

OUT

OUTQ

MGU100

Fig.24 Bonding pad locations of the TZA3043U.

Fig.25 Bonding pad locations of the TZA3043BU.

2002 Sep 06

19

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