HEF4050B Ver la hoja de datos (PDF) - NXP Semiconductors.
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HEF4050B Datasheet PDF : 11 Pages
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NXP Semiconductors
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
HEF4050B
Hex non-inverting buffers
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 7. Package outline SOT38-4 (DIP16)
HEF4050B_5
Product data sheet
Rev. 05 — 11 November 2008
© NXP B.V. 2008. All rights reserved.
7 of 11
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