CXA1619BM Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA1619BM Datasheet PDF : 11 Pages
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Package Outline Unit : mm
CXA1619BM
28
28PIN SOP (PLASTIC)
+ 0.4
18.8 – 0.1
15
+ 0.4
2.3 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
14
1.27
+ 0.1
0.2 – 0.05
CXA1619BM/BS
CXA1619BS
0.24 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-28P-L04
SOP028-P-0375
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
0.7g
30PIN SDIP (PLASTIC)
+ 0.4
26.9 – 0.1
30
16
1
15
1.778
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-30P-01
SDIP030-P-0400
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
1.8g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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