EN5330 Ver la hoja de datos (PDF) - Enpirion, Inc.
Número de pieza
componentes Descripción
Fabricante
EN5330 Datasheet PDF : 11 Pages
| |||
Rev 1.0 – July 2005
EN5330
Landing Pad Information
The Enpirion DFN package is footprint compatible with the JEDEC standard 36-pin TSSOP package code DD.
The reference document and board layout diagram appear below.
JEDEC Solid State Technology Association TSSOP (Plastic Thin Shrink Small Outline Package)
standardized package code DD. This TSSOP standard package is defined in the JEDEC document
MO-153, Issue F, dated 05/01, which defines 57 variations on package size, lead pitch, and lead
count.
Contact Information
Enpirion, Inc.
685 Route 202/206
Suite 305
Bridgewater, NJ 08807
Phone: 908-575-7550
Fax: 908-575-0775
Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is believed to be
accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may result from its use. Enpirion
products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment used in hazardous environment without the
express written authority from Enpirion.
11
www.enpirion.com
Share Link: 