DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

HFBR-1119T Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza
componentes Descripción
Fabricante
HFBR-1119T Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
VBB
RECEIVER
QUANTIZER
IC
ELECTRICAL
SUBASSEMBLIES
TRANSMITTER
PREAMP IC
DRIVER IC
PIN PHOTODIODE
OPTICAL
SIMPLEX ST®
SUBASSEMBLIES RECEPTACLE
LED
TOP VIEW
Figure 1. Transmitter and Receiver Block Diagram.
The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from
other vendors.
The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.
The electrical subassemblies con-
sist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.
THREADS
3/8 – 32 UNEF-2A
HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE
8.31
12.19
MAX.
41 MAX.
5.05
7.01
5.0
2.45
19.72
0.9
9.8 MAX.
3
NOTES:
12
1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.
2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.
3. UNITS = mm
Figure 2. Package Outline Drawing.
17.78
(7 x 2.54)
8 x 7.62
HOUSING PINS 0.38 x 0.5 mm
NOTE 1
PCB PINS
DIA. 0.46 mm
NOTE 2
201

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]