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HFBR-5104 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HFBR-5104 Datasheet PDF : 22 Pages
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FDDI PMD and LCF-PMD
These transceivers are compat-
standards without violating the
ible with either industry standard
worst case output electrical jitter wave or hand solder processes.
allowed in the Tables E1 of the
Annexes E.
Shipping Container
The transceiver is packaged in a
The jitter specifications stated in shipping container designed to
the following 1300 nm
protect it from mechanical and
, transceiver specification tables
are derived from the values in
Tables E1 of Annexes E. They
represent the worst case jitter
contribution that the transceivers
are allowed to make to the overall
system jitter without violating the
Annex E allocation example. In
practice the typical contribution
ESD damage during shipment or
storage.
of the HP transceivers is well
below these maximum allowed
NO INTERNAL CONNECTION
amounts.
Board Layout - Decoupling
Circuit and Ground Planes
It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these transceivers. Figure 7
provides a good example of a
schematic for a power supply
,decoupling circuit that works well
with these parts. It is further
recommended that a contiguous
NO INTERNAL CONNECTION
 Recommended Handling
Precautions
Hewlett-Packard recommends
that normal static precautions be
taken in the handling and
assembly of these transceivers to
prevent damage which may be
induced by electrostatic
discharge (ESD). The HFBR-
HFBR-510X
TOP VIEW
Rx
Rx Tx
Tx
VEE RD RD SD VCC VCC TD TD VEE
1
2
3
4
5
6
7
8
9
5100 series of transceivers meet
C1
C2
MIL-STD-883C Method 3015.4
Class 2 products.
TERMINATION
L1 L2
VCC
R2 R3
Care should be used to avoid
shorting the receiver data or
signal detect outputs directly to
ground without proper current
limiting impedance.
Solder and Wash Process
Compatibility
The transceivers are delivered
with protective process plugs
inserted into the duplex SC or
duplex ST connector receptacle.
,,,, AT PHY
DEVICE
INPUTS
VCC
R5 R7
C6
R6
R8
C3
C4
VCC FILTER
AT VCC PINS
TRANSCEIVER
R9
R10
R1
R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
RD RD SD
VCC
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
This process plug protects the
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
optical subassemblies during
wave solder and aqueous wash
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
processing and acts as a dust
cover during shipping.
C4 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR.
Figure 7. Recommended Decoupling and Termination Circuits
132

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