CX11250 Ver la hoja de datos (PDF) - Unspecified

Número de pieza

componentes Descripción

Fabricante

CX11250

SmartHSF™ Mobile Modem

Unspecified 

SmartHSF Mobile Modem Data Sheet

4.1.14 0x3D - Interrupt Pin Register...................................................................................................... 4-4

4.1.15 0x3E - Min Grant Register.......................................................................................................... 4-4

4.1.16 0x3F - Max Latency Register ..................................................................................................... 4-4

4.1.17 0x40 - Capability Identifier.......................................................................................................... 4-4

4.1.18 0x41 - Next Item Pointer ............................................................................................................ 4-4

4.1.19 0x42 - PMC - Power Management Capabilities ......................................................................... 4-5

4.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4) ............................... 4-5

4.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 4-6

4.1.22 0x47 - Data................................................................................................................................. 4-6

4.2 BASE ADDRESS REGISTER .................................................................................................................. 4-6

4.3 SERIAL EEPROM INTERFACE ............................................................................................................... 4-7

4.3.1 Supported EEPROM Sizes ........................................................................................................ 4-7

4.3.2 Definitions .................................................................................................................................. 4-8

Device ID Register ............................................................................................................ 4-8

Vendor ID Register............................................................................................................ 4-8

Subsystem Vendor ID and Subsystem Device Register ................................................... 4-8

Min_Gnt Register .............................................................................................................. 4-8

Max_Lat Register .............................................................................................................. 4-8

PMC [8:6] and PME DRV Type ......................................................................................... 4-9

Class Code Register (Class Code, Sub-class Code, Prog. I/F) ........................................ 4-9

CardBus CIS Pointer (CardBus CIS pointer High, CardBus CIS pointer Low) (Not

Used)................................................................................................................................. 4-9

Data Scale PMCSR[14:13] (D0C, D1C, D2C, D3C, D0D, D1D, D2D, D3D) ..................... 4-9

Data Register (D3, D2, D1, D0 power consumed and D3, D2, D1, D0 power

dissipated)......................................................................................................................... 4-9

Load CISRAM Count (CIS _SIZE) (Not Used) .................................................................. 4-9

5. PACKAGE DIMENSIONS................................................................................................................................... 5-1

100553B

Conexant

v

Share Link: