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BUK7615-100A/T3 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
BUK7615-100A/T3
NXP
NXP Semiconductors. NXP
BUK7615-100A/T3 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Philips Semiconductors
TrenchMOStransistor
Standard level FET
Product specification
BUK7615-100A
GENERAL DESCRIPTION
N-channel enhancement mode
standard level field-effect power
transistor in a plastic envelope
suitable for surface mounting. Using
trench’ technology the device
features very low on-state
resistance. It is intended for use in
automotive and general purpose
switching applications.
QUICK REFERENCE DATA
SYMBOL PARAMETER
VDS
ID
Ptot
Tj
RDS(ON)
Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance
VGS = 10 V
MAX.
100
75
230
175
15
PINNING - SOT404
PIN
DESCRIPTION
1 gate
2 drain (no connection
possible)
3 source
mb drain
PIN CONFIGURATION
mb
2
13
SYMBOL
d
g
s
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
VDS
VDGR
±VGS
ID
ID
IDM
Ptot
Tstg, Tj
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage & operating temperature
-
RGS = 20 k
-
Tmb = 25 ˚C
Tmb = 100 ˚C
Tmb = 25 ˚C
Tmb = 25 ˚C
-
THERMAL RESISTANCES
SYMBOL
Rth j-mb
Rth j-a
PARAMETER
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
CONDITIONS
-
Minimum footprint, FR4
board
MIN.
-
-
-
-
-
-
-
- 55
MAX.
100
100
20
75
53
240
230
175
TYP.
-
50
MAX.
0.65
-
UNIT
V
A
W
˚C
m
UNIT
V
V
V
A
A
A
W
˚C
UNIT
K/W
K/W
January 1999
1
Rev 1.000

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